Air

• Contamination removal (chemical)
• Oxidation process
• Surface activation (wetting & adhesion)

O2

• Contamination removal (chemical)
• Oxidation process
• Surface activation (wetting & adhesion)
• Etch (organics)
• Surface sterilization
• Note: a special 'oxygen service' vacuum pump must be used in conjunction with O2 process gas in order to avoid risk of possible injury; inquire with Harrick Plasma for details

Ar

• Contamination removal (ablation)
• Surface activation (wetting & adhesion)
• Crosslinking
• Surface sterilization (not as effective as O2)

H2O (water vapor)

• Surface activation (hydroxyl groups)

N2

• Surface activation (wetting & adhesion)

H2

• Contamination removal (chemical)
• Surface activation
• Note: Extreme caution must be exercised when working with H2 process gas in order to minimize the risk of possible injury. Consult with Harrick Plasma for H2 plasma processing