Gas Sources for Plasma Surface Cleaning and Modification

Air

• Contamination Removal (chemical)
• Oxidation Process
• Surface Activation

O2

• Contamination Removal (chemical)
• Oxidation Process
• Surface Activation (wetting & adhesion)
• Etch (organics)
• Deposition (glass (w/ Si))
• Note: a special 'oxygen service' vacuum pump must be used in conjunction with O2 process gas in order to avoid risk of possible injury; inquire with Harrick Scientific for details

N2

• Surface Activation
• Deposition (silicon nitride (w/ Si), metal nitride (w/ M))

Ar

• Contamination Removal (ablation)
• Crosslinking

H2

• Contamination Removal (chemical)
• Surface Modification (curing)
• Reduction Process (metal oxide)
• Deposition (metals (w/ M))
• Note: Extreme caution must be exercised when working with H2 process gas in order to minimize the risk of possible injury.