Note: A detailed User's Manual is provided with all Harrick Plasma's Plasma Cleaner models.

Principles of Operation

• The sample is placed in the plasma vacuum chamber
• Process gas(es) are admitted to the chamber at low flow rates (1-2 SCFH) using either a needle valve or the PlasmaFlo accessory and are kept at low pressure (~200-600 mTorr) through vacuum pumping
• The gases are subject to induced RF magnetic and electric fields generated by a solenoidal coil current
• Plasma is generated through the subsequent RF/collisional heating of the electrons in the gas

Details of Operation

• The plasma vacuum chamber door has an o-ring quick disconnect seal for easy access to the chamber
• The vacuum pump is connected to an outlet at the back of the reaction chamber
• The needle valve is used to bleed in process gas and control the pressure during plasma processing
• The RF power level can be adjusted by means of a three-way selector switch
• The plasma will emit a characteristic glow, which visibly indicates the successful generation of the plasma state
• The temperature change of a substrate during plasma treatment is minimal
• The 3-way valve is used to quickly switch from bleeding in gas, isolating the chamber, and venting

Surface Cleaning / Modification

• The interaction between the plasma and the surface is determined by:
• The nature of the substrate and surface contaminant layers
• The process gases used
• The pressure and flow rate of the gases
• The RF power level & length of sample exposure
• For surface cleaning, a few seconds exposure, following pump down of the chamber and formation of plasma, is often adequate
• Surface cleanliness can be tested most easily by observing the wettability of the sample: on a clean surface, water drops will not bead, but will spread out in a uniform film