Title: Method for Creating Adhesion During Fabrication of Electronic Devices

Author(s): Chaudhury, Manoj Kumar, Andrew James Goodwin, Yeong Joo Lee, Bhukandas Parbhoo, Geoffrey Bruce Gardner

Entity: The Dow Chemical Company

Patent Number: US20050031795 A1. Published: Feb. 10, 2005.

Abstract:
A method for creating adhesion includes plasma treating two substrates and thereafter contacting the substrates. The method can be used on a variety of dry surfaces. The method is used to adhere nonadhesive surfaces such as a cured silicone with a ceramic or semiconductor.