Title: No-Flow Flux Adhesive Components
Author(s): Charles, Scott B., Robert J. Kinney, Michael A. Kropp, Roger A. Mader
Entity: 3M Innovative Properties Company
Patent Number: US6528169 B2. Granted: Mar. 04, 2003. Published: Mar. 14, 2002.
The invention provides adhesives and adhesive compositions that comprise epoxy resin and non-volatile anhydride. One embodiment further comprises a hydroxyl containing compound that is insoluble in the epoxy resin/anhydride blend at mixing temperatures which reacts with the anhydride at solder reflow temperatures to form a fluxing agent in-situ. Another embodiment further comprises catalyst.