Title: Method and Apparatus for Patterning a Conductive Layer, and a Device Produced Thereby
Author(s): Walter, H., T. Beierlein
Patent Number: WO 2007074404. Published: July 05, 2007.
A device is fabricated by a method in which a conductive layer or layer stack is formed over a compressible layer or layer stack, and contacted with an embossing tool. Raised portions of the embossing tool compress the compressible layer or stack and countersink the conductive layer or stack into the compressible layer or stack.